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NoorTech

About

A Malaysian chip company, rooted in automotive compute and reaching globally.

We focus on computing chips as our core business, while incubating the supporting industries of automotive chip testing and advanced packaging. Our goal is to become a world-class semiconductor group.

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Company

Building a world-leading computing-chip cluster, from Malaysia outward.

Incorporated in April 2026 with RM 10,000,000 in registered capital, NoorTech is rooted in automotive compute and reaching globally, with R&D centres being established in China, North America, Europe and Japan, and joint ventures forming in packaging and test.

Headquarters in Malaysia, with R&D centres being registered in China, Japan, Europe and North America. China Japan Europe North America Malaysia
Headquarters R&D centres, in registration
Incorporated
2026
Registered capital
RM 10,000,000
Headquarters
Malaysia
R&D centres, in registration
Four regions

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Vision and plan

With surging computing power, AI breathes life into machines.

Automotive intelligence and electrification, the growth of AI and the low-altitude economy are all asking for more compute. Over three to six years in high-compute SoCs we plan three leaps: catch up, surpass, lead, and set a benchmark for the industry.

Generation 1

Own the core

Self-developed NPU core IP, full SoC architecture and system verification, covering automotive ADAS, central computing platforms and robot brain fusion.

Generation 2

Everywhere at the edge

Builds on the first generation to lower cost and raise efficiency, moving towards ubiquitous end-side central computing in industrial and consumer products.

Generation 3

Into the cloud

Cloud-side inference on an advanced process with a more general-purpose NPU, building proprietary computing hardware on the first-generation platform.

  1. 2026

    Company founded, chip R&D started

  2. 2028

    First chip taped out

  3. 2029

    Chips mass-deployed in vehicles; automotive test line launched

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Leadership

A top-tier NPU IP team, complemented by a high-compute SoC team.

Hawk

SoC Architecture

20+ years in IC. Deputy Chief Engineer, Technical Director, CTO & Deputy GM of an automotive BU. Core contributor to HiSilicon Kirin AI IP.

Jason

NPU Architecture

Former AI chief expert at Huawei Smart Engineering. Lead architect on a first-generation cloud LLM inference chip. Former NPU architect at Qualcomm and NIO.

Oliver

NPU Compiler

PhD in compilation, Chinese Academy of Sciences. Led NPU architecture for a high-compute ADAS chip at sparse INT8 above 1000T.

Steven

SoC Design

15 years and 10+ mass-production chip programmes. Most recently responsible for cloud-side high-compute SoC architecture and design.

James

Software Solutions

20 years in chip system software across multimedia and AI, spanning edge-side and cloud-side high-compute inference.

Zora

Hardware Solutions

16 years in post-silicon test and hardware architecture. Automotive-grade certification across multiple vehicle-grade chips.

Contact

Driving the future of intelligence.

Partners, investors and engineers: we would like to hear from you.

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